Adhesion & Bonding Expo Osaka 2024: Industrial Adhesion & Bonding Technologies

Adhesion & Bonding Expo Osaka : Event Name
Category: Chemical and Dyes
Event Date: 08 – 10 May, 2024
Frequency: Annual
Location: INTEX Osaka – 1-5-102, Nanko-Kita, Suminoe-ku, Osaka, 559-0034 Japan
Organizer: RX Japan Ltd. – 11F Tokyo Midtown Yaesu, 2-2-1 Yaesu, Chuo-ku, Tokyo 104-0028 Japan
Phone: +81-3-6739-4118
Email: materialweek-e.jp[at]rxglobal.com
Timings: 10:00 AM – 17:00 PM
Tickets: Visitor Registration Required – Click Here!

Adhesion & Bonding Expo Osaka 2024 – Japan’s Largest Show for All Industrial Adhesion & Bonding Technologies!

Adhesion & Bonding Expo Osaka 2024: Overview

Adhesion & Bonding Expo Osaka 2024 is the leading industrial adhesion expo that gathers joining equipment and bonding technologies from materials to welding, friction stirring, ultrasonic, diffusion, and more. It also attracts attentions for dissimilar material joining technologies. Held twice a year in Osaka and Tokyo, attendees can explore a wide variety of adhesive agent, test out industrial equipment, and learn from industry experts throughout the technical conference sessions.​

The Adhesion & Bonding Expo Osaka 2024 is a significant trade fair held at INTEX Osaka, one of the largest exhibition and event centers in Japan. Founded in 1985, INTEX Osaka is conveniently located near Kansai Airport and the Port of Osaka. The Adhesion & Bonding Expo Osaka 2024 is organized by RX Japan Ltd., a subsidiary of the Reed Exhibitions Group, which specializes in organizing trade fairs and events in various industries. The fair targets companies and professionals in the fields of adhesives and sealants, surface treatment and finishing, as well as application-specific technologies and services.

At the Adhesion & Bonding Expo Osaka 2024, participants can learn about the latest products, technologies, and trends in adhesion and bonding technology. The fair’s focus is on innovative solutions for industries such as automotive, aerospace, electronics, construction, and medical technology. A wide range of products and technologies relevant to various applications and industries are exhibited, including adhesives such as epoxy resins, polyurethanes, silicones, cyanoacrylates, hot-melt adhesives, and UV-curing adhesives, as well as sealants like silicone sealants, polyurethane sealants, acrylic sealants, and butyl sealants. In addition, surface treatments, adhesive application systems, and joining methods for composite materials are presented. The Adhesion & Bonding Expo is part of the Highly-functional Material Week, an event series that brings together various trade fairs focused on high-performance materials and technologies under one roof. The Highly-functional Material Week takes place annually in Osaka and serves as an essential platform for professionals and companies from different industries. In addition to the Osaka location, the Adhesion & Bonding Expo is also held in Chiba, a major exhibition center near Tokyo. The annual rotation, with the event held in Osaka in spring and Chiba near Tokyo in autumn, allows the fair to attract a broad spectrum of participants and exhibitors from various regions of Japan and beyond. This event provides participants with an excellent opportunity to present their products and services to an even larger audience and learn about the latest developments in the industry.

The Adhesion & Bonding Expo Osaka 2024 will take place on 3 days from Wednesday, 08. May to Friday, 10. May 2024 in Osaka.

Benefits of Exhibiting: